DDB

DOES WITH CONTINUOUS AND BINARY MICRORELIEF DEVELOPED AND FABRICATED AT IPSI RAS

DOE type
Wave-length,
mm
Aperture,
mm
Focal length,
mm
Focal line size
Type of microrelief
Fabrication technique
“Segment”*
10,6
50
1200
20 mm
continuous.
LPPC
“Ring”*
10,6
50
800
20 mm
continuous.
BCG
“Ring”***
1,06
35
150
3õ1
binary
PCE
“Twin-spots”***
1,06
35
150
0õ1,5 mm
binary
PCE
Rectangular area***
1,06
35õ35
150
1õ3 mmv
binary
PCE
“À” letter**
1,06
5
100
5 mm
binary
PL
p” letter*
10,6
18
250
10õ10
continuous.
BCG
Lens array **
0,55
5õ5, 100õ100
3
-
binary
PCE
Satterer (diffraction grating)*****
0,55
1000 line./mm
-
-
binary
EBL, PCE

Substrate material:
* - copper
** - glass
*** - fused silica
**** - silicon
***** - polymethylacrylate
****** - photoresist coated with Al/ Ag-filmé

LPPC – liquid photopolymerizable composition
BCG - bi-chromized gelatin
PCE- plasmo-chemical etching
EBL - e-beam lithography
UPG - uniform photoresist growth
UCE - uniform copper etching
PL - photolithographyÿ

 

DDB